With the accelerated development of low-Earth orbit satellite constellations and the advancement of integrated ‘air-space-land-sea’ communication networks, satellite communication chips are becoming a key focus of the global technology industry. As a specialist service provider with nearly 30 years’ experience in the semiconductor supply chain sector, Shenzhen Mingjiada Electronics Co., Ltd. is currently seeking to procure various types of satellite communication chips on a long-term basis from around the world, covering leading brands such as Quectel, Qorvo, ADI, TI, ST, Infineon and Qualcomm.
I. Key Application Scenarios for Satellite Communication Chips
Thanks to their advantages of wide coverage, immunity to terrain constraints and high reliability, satellite communication chips are rapidly penetrating the consumer market from specialist applications. The following are the most critical application scenarios at present:
1. Emergency Communications and Disaster Relief
When natural disasters such as earthquakes, floods and typhoons cause damage to ground-based base stations, satellite communications are the only reliable means of communication. Portable terminals equipped with integrated satellite communication chips can rapidly establish emergency communication links following the disruption of fibre-optic cables and base stations, serving as a ‘lifeline’ for transmitting vital information. The BeiDou-3 short message SoC chip released by Huada BeiDou has already played a significant role in scenarios such as emergency rescue, meteorological data collection and power data collection.
2. Marine Fisheries and Deep-sea Shipping
In vast stretches of ocean far from the coast, terrestrial networks offer absolutely no coverage. Shipboard terminals powered by satellite communication chips enable functions such as vessel positioning, transmission of navigation data and crew communications. Satellite communication chips released by companies such as China Mobile Xinsheng have been widely adopted in high-value sectors such as deep-sea shipping and marine fisheries. Puyou Technology’s low-Earth orbit satellite communication chip products have also been deployed in large numbers in shipboard applications.
3. Direct Satellite Connectivity for Mobile Phones and Consumer Electronics
In recent years, direct satellite connectivity has become a standard feature in flagship smartphones. Qualcomm’s Snapdragon Satellite baseband chips (X70, X80), which support the 3GPP NTN standard, have enabled voice calls, text messaging and low-speed data transmission in numerous flagship models. Furthermore, satellite communication technology is expanding into everyday consumer sectors such as smartwatches and smart cars.
4. In-Vehicle Communications and Intelligent Driving
In-vehicle satellite communication terminals enable vehicles to remain connected in real time in areas without terrestrial network coverage. Qualcomm’s SA8155P automotive-grade satellite communication chip supports dual-mode satellite and cellular communication, is suited to integrated ground-to-space scenarios for vehicle-to-everything (V2X) networks, and provides ‘never-disconnect’ communication assurance for intelligent driving. Xinsemi’s satellite communication baseband chips have achieved widespread adoption in consumer-grade scenarios such as in-vehicle communications.
5. Low-Altitude Economy and Aviation Interconnectivity
With the rise of the low-altitude economy, low-altitude aircraft such as drones and eVTOLs have created new demands for comprehensive communication connectivity. Satellite communication chips can be adapted for scenarios such as airborne terminals and aviation interconnectivity. The multi-mode, multi-standard SDR satellite internet terminal baseband chip launched by White Box can be widely applied in fields such as airborne, marine and in-vehicle terminals.
6. Internet of Things (IoT) and Smart Agriculture
Satellite IoT chips enable data collection and transmission in remote areas without terrestrial network coverage. Typical applications include agricultural monitoring, marine ranch management, geological hazard early warning, smart water management, field exploration and asset tracking. Kaiyuan Communications’ launch of the world’s first satellite PAMiD product provides high-performance RF solutions for emergency communications, maritime transport, remote monitoring and smart agriculture.
7. Low-Earth Orbit (LEO) Satellite Internet (Starlink, etc.)
The development of low-Earth orbit satellite constellations has generated substantial demand for ground terminal chips. Satellite communication chips are core components in the construction of user terminals and ground stations for low-Earth orbit satellite internet systems such as Starlink. The core chips for phased-array antennas, gallium arsenide (GaAs) RF chips and satellite communication modem chips, on which Mingjiada focuses, are precisely the key components suited to such scenarios.
II. Satellite Communication Chip Product Series Sought by Mingjiada Electronics
Mingjiada Electronics is actively seeking to purchase the following satellite communication chips and modules at premium prices from around the world, covering all types of stock, including brand-new, original packaging items and obsolete inventory:
1. Quectel Satellite Communication Module Chips
Mingjiada is currently issuing a global call for the purchase of Quectel satellite communication module chips, with a particular focus on the following series:
BG95: ‘Satellite + Cellular’ dual-mode module, supporting voice, SMS and data transmission, compatible with cellular standards such as LTE Cat M1, Cat NB2 and EGPRS
BG770: Highly integrated, ultra-compact design, suitable for miniaturised terminals
CC660: Supports L/S dual-band
CC200: Equipped with the ORBCOMM platform, compatible with Inmarsat GEO L-band
The full range of products, including LTE Cat 1/Cat 4 modules supporting D2C (Direct-to-Cell) technology, etc.
2. Qorvo (including Anokiwave) Beamforming ICs
Mingjiada has long been supplying and recycling Qorvo satellite communication beamformer ICs, covering multi-band and multi-channel requirements:
AWMF-0240: Ku-band, four-channel satellite communication beamformer, utilising CMOS technology, operating in the 10.7 GHz–12.75 GHz band, compatible with LEO/MEO/GEO multi-orbit satellite communication systems
AWS-0102: Dedicated satellite communication beamforming IC, operating at 17.7–20.2 GHz, supporting four dual-polarisation radiating elements
AWMF-0146 / AWMF-0147: Second-generation Ku-band satellite communication beamformers, specifically designed for ‘communications-on-the-move’ flat-panel antenna terminals
AWMF-0144 / AWMF-0145: Ku-band quad-core transmit/receive beamforming chips
AWMF-0156 / AWMF-0158: Beamforming chips for the 37–40 GHz / 26.5–29.5 GHz frequency bands
Other models: AWMF-0221, AWMF-0197, AWMF-0198, AWMF-0108, AWMF-0109, etc.
3. ADI (Analog Devices) Satellite Communications RF Chips
Mingjiada specialises in the supply and recycling of the full range of ADI brand satellite communications RF chips, covering the entire Ku/K/Ka frequency bands:
ADMV4530: Ka-band upconverter, featuring an integrated I/Q mixer, low-phase-noise PLL and VCO
ADMV4540: Ka-band orthogonal demodulator, integrating dual LNA paths and a programmable low-pass filter
ADMV4680: Ku-band beamforming chip, integrating four T/R channels on a single chip
ADRV9009: High-performance satellite RF transceiver
4. TI (Texas Instruments) radiation-hardened RF chips
Mingjiada is urgently sourcing TI radiation-hardened RF ADC/DAC chips globally, specifically designed for X-band satellite communications and radar payloads, and suitable for low-Earth orbit satellite constellations, deep-space exploration and high-reliability radar systems.
5. STMicroelectronics (ST) Satellite Communications Chips
Mingjiada supplies and recycles the full range of ST satellite communications chips:
STM32 series: STM32H743VGT6, STM32L496VGT6 and other highly radiation-resistant microcontrollers, suitable for on-board satellite equipment
GNSS navigation chips: STA8100, STA8090, supporting multi-system joint positioning via GPS, BeiDou, Galileo and GLONASS
BiCMOS RF antenna chips: specifically designed for Starlink terminals, supporting the Ku and Ka bands
6. Qualcomm satellite terminal chips
Snapdragon Satellite baseband chips: X70, X80, supporting the 3GPP NTN standard
7. Infineon radiation-hardened memory chips
Mingjiada supplies and recycles Infineon’s NewSpace memory product portfolio, including radiation-hardened memory chips, suitable for the extreme space environments of satellite-borne equipment.
III. Why Choose Mingjiada Electronics
Mingjiada Electronics was established in 1996 and is headquartered in Shenzhen, with branches in Hong Kong, Japan, Russia and Taiwan. The company holds dual ISO 9001 and ISO 14001 certifications. The company maintains a stock of over 2 million SKUs and has established long-term, stable partnerships with more than 500 renowned global semiconductor brands.
In the field of satellite communication chips, Mingjiada has established a comprehensive supply system covering satellite navigation (GNSS) RF front-ends, on-board memory, signal processing and ground station support chips. It simultaneously provides a two-way, closed-loop ‘supply + recycling’ supply chain service, helping the industry to reduce costs, improve efficiency and promote the recycling of resources.
IV. Collaboration Opportunities
If you hold stock of the aforementioned satellite communication chips (Quectel modules, Qorvo/AWMF series, ADI RF chips, TI radiation-hardened chips, and brands such as ST, Qualcomm and Infineon), or are able to provide Mingjiada with stable supply channels, please feel free to contact us at any time:
Contact: Mr Chen
Mobile: +86 13410018555 (same number on WeChat)
Email: sales@hkmjd.com
Address: Rooms 1239–1241, Block B, Guoli Building, Phase II, New Asia, Zhenzhong Road, Futian District, Shenzhen
Adhering to the philosophy of “Reputation First, Quality First, Service Foremost”, Mingjiada Electronics looks forward to collaborating with global partners to jointly promote the large-scale implementation of integrated “air, space, land and sea” communication networks.
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