কোম্পানির ব্লগ সম্পর্কে Supply TI DSP SoCs:Audio DSP SoCs,Radar DSP SoCs

Supply TI DSP SoCs:Audio DSP SoCs,Radar DSP SoCs

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I. Key Features of the TI DSP SoC Technical Architecture

TI’s dedicated DSP SoCs eschew the redundant design of general-purpose processors, adopting a heterogeneous architecture comprising an ‘Arm control core + dedicated DSP computing core + scenario-specific hardware accelerators + integrated peripherals’, balancing real-time control, high-density digital signal processing, and the requirements for low power consumption and high reliability. Compared to general-purpose MCUs and CPUs, their core advantages lie in three key areas: firstly, built-in hardware signal processing accelerators eliminate the need for pure software computation, resulting in lower latency; secondly, dual real-time assurance through both software and hardware meets the high-frequency sampling and real-time computation requirements of applications such as audio and radar; and thirdly, high integration simplifies end-device hardware design whilst reducing BOM costs and device size.

Furthermore, to address the demanding conditions of automotive and industrial applications, all core models in the range support wide-temperature operation, hardware-based security encryption and fault-tolerance mechanisms. They meet AEC-Q100 automotive-grade certification and industrial reliability standards, making them suitable for complex operating environments.

II. TI Audio DSP SoCs (Dedicated to Automotive and Professional Audio)

TI’s audio DSP SoCs are specialised chips designed for high-definition audio processing, in-vehicle audio-visual systems, professional audio systems, and noise and echo cancellation applications. They focus on low latency, high fidelity and multi-channel parallel audio processing, featuring a lightweight, high-performance, DDR-free minimalist architecture that meets mainstream consumer and automotive audio requirements.

1. Core Architecture and Technical Features

The audio DSP SoC utilises TI’s next-generation C7x vector DSP and the classic C66x DSP as its computational cores, paired with an Arm real-time control core. It features deep instruction set optimisation tailored for audio algorithms, making it perfectly suited for mainstream applications such as AEC (Acoustic Echo Cancellation), ANC (Active Noise Cancellation), EQ (Equalisation), sound effects rendering, multi-channel mixing and audio codecs. Key features are as follows:

- Tiered computing architecture: Divided into a highly integrated architecture without DDR and a DDR-extended architecture. Entry-level models offer up to 40 GFLOPS of computing power, whilst the high-end AM2754-Q1 model delivers a peak computing power of 80 GFLOPS and 8k DMIPS, meeting the requirements for parallel processing of multi-channel high-definition audio;

- Ultra-low-latency real-time processing: Hardware-level audio acceleration supports nanosecond-level response times, eliminating audio stuttering, latency and distortion, and is suitable for in-vehicle real-time audio-visual applications and real-time call noise cancellation scenarios;

- Highly integrated, minimalist design: Features built-in high-capacity on-chip SRAM (up to 10.75 MB); certain models do not require external DDR memory, significantly simplifying PCB design whilst reducing power consumption and costs;

- Extensive audio peripherals: Native support for dedicated audio interfaces such as I²S, TDM and SPDIF, with support for synchronous multi-channel audio capture and output, suitable for multi-channel in-vehicle audio systems and distributed audio systems;

- High-reliability adaptation: Automotive-grade models support a wide operating temperature range of –40°C to 125°C, with built-in hardware secure boot and encryption protection, making them suitable for the demanding conditions of in-vehicle environments.

2. Mainstream Core Models and Specifications

TI’s audio DSP SoCs are primarily automotive-grade products, covering the full spectrum from entry-level to mid-range and high-end. The specifications for the mainstream models are as follows:

- AM62D-Q1: A classic automotive audio SoC, featuring Cortex-A53 and R5F cores, with a C7x DSP delivering a peak processing power of 40 GFLOPS. It supports LPDDR4 and is suitable for mid- to high-end in-vehicle audio-visual systems and in-vehicle power amplifiers, offering excellent value for money and stable performance;

- AM2754-Q1 (next-generation high-end model): Features a quad-core Cortex-R5F control core, 10.75 MB of on-chip SRAM, a DDR-free architecture, and a peak computing power of 80 GFLOPS. It offers lower power consumption and higher integration, making it suitable for high-end in-vehicle noise cancellation systems and immersive audio solutions;

- DRA780/DRA781/DRA782: Audio SoCs based on the classic C66x DSP architecture, with clock speeds ranging from 500 MHz to 750 MHz, paired with dual-core Cortex-M4 cores. Designed specifically for in-vehicle audio amplifiers and in-vehicle multimedia audio processing, they boast a mature ecosystem and exceptional mass-production stability.

3. Core Application Scenarios

The focus is primarily on the consumer and automotive audio sectors. Key application scenarios include: in-vehicle immersive audio systems, in-vehicle active noise cancellation (ANC), in-vehicle acoustic echo cancellation (AEC), professional power amplifiers, smart home audio terminals and high-definition audio codec devices. These chips are currently the mainstream core components for automotive audio systems.

III. TI Radar DSP SoCs (Dedicated to Millimetre-Wave Radar)

The TI Radar DSP SoC is a single-chip solution designed for 76–81 GHz automotive millimetre-wave radar and industrial ranging radar. Distinct from general-purpose DSPs, its key feature is the integration of four components—RF front-end, MCU control, DSP processing power and radar hardware accelerators—into a single chip, eliminating the need for external RF chips. It is currently a core chip for autonomous driving and automotive perception.

1. Core Architecture and Technical Features

The Radar DSP SoC utilises a 45nm RFCMOS process and integrates an FMCW radar RF transceiver front-end, a real-time control MCU, a dedicated radar DSP and a hardware signal processing accelerator. It is specifically optimised for radar intermediate-frequency signal processing, target detection, range and velocity measurement, and point cloud analysis algorithms. Its core features are as follows:

- Fully integrated single-chip solution: Integrates the RF antenna, transceiver chain, ADC sampling, DSP processing and control unit; certain AOP models feature an integrated antenna within the package, drastically simplifying radar hardware design;

- Dedicated radar computing acceleration: Built-in hardware accelerators for radar FFT, peak detection and cluster tracking enable rapid radar signal denoising, spectrum analysis, target recognition and trajectory fitting, with highly targeted computing power;

- High-bandwidth, high-precision detection: Supports the 76 GHz–81 GHz frequency band dedicated to automotive radar, offering high ranging accuracy and strong interference resistance, making it suitable for high-speed, complex road condition perception scenarios in vehicles;

- Low power consumption and high reliability: Ultra-low standby and operating power consumption; supports automotive-grade wide temperature operation; features a built-in self-monitoring module that can detect RF and processing statuses in real time, enhancing the stability of the radar system;

- Real-time decision-making capability: Features a built-in real-time MCU core capable of independently processing radar data and outputting results without the need for an external host controller, achieving response times in the microsecond range.

2. Mainstream Core Models and Specifications

TI’s automotive radar DSP SoC product line is comprehensive, covering short-, medium- and long-range radar applications. The mainstream core models are as follows:

- AWR1843AOP: A best-selling single-chip automotive radar SoC with an antenna-on-package (AOP) design, operating in the 76–81 GHz frequency band. It integrates DSP and MCU cores and is suitable for short-range automotive radar applications (such as Blind Spot Detection (BSD) and parking sensors), offering an extremely compact form factor and maximum integration;

- AWR2944: A mid-to-high-end automotive radar chip offering greater computing power and more channels, supporting multi-antenna arrays; suitable for mid- to long-range forward-looking automotive radar, used in ACC (Adaptive Cruise Control) and AEB (Automatic Emergency Braking);

- AWR2544: A high-frequency, satellite-grade FMCW radar SoC, suitable for high-precision industrial ranging and high-end automotive perception radar, supporting accurate multi-target detection in complex environments.

3. Core Application Scenarios

Primarily serving automotive autonomous driving perception and industrial high-precision ranging, practical applications include: automotive blind spot monitoring, automated parking, adaptive cruise control, emergency braking assistance, lane change assistance, as well as industrial material ranging, liquid level detection and security radar detection.

IV. Comparison of Key Differences Between Audio DSP SoCs and Radar DSP SoCs

Although both types of chips belong to TI’s dedicated DSP SoC series, they differ significantly in architecture, computing power, peripherals and functional positioning due to their distinct application scenarios. The key comparisons are as follows:

- Different core positioning: Audio DSP SoCs focus on audio signal fidelity, noise reduction and multi-channel processing, prioritising low latency and high sound quality; Radar DSP SoCs focus on the analysis of millimetre-wave RF signals, target detection and ranging, prioritising high precision and high immunity to interference;

- Different integrated architectures: Audio DSP SoCs feature an ‘Arm + DSP + audio peripherals’ configuration, without an RF module; radar DSP SoCs feature an ‘RF front-end + Arm + radar DSP + radar accelerator’ configuration, with full-chain integration;

- Different directions of computational optimisation: Audio DSPs are optimised for audio algorithms such as EQ, AEC and codecs; radar DSPs are optimised for FFT transforms, target clustering, trajectory tracking and radar signal noise reduction algorithms;

- Different operating frequency bands: Audio chips do not operate at high RF frequencies, focusing instead on low-frequency audio signals; radar chips are dedicated to the 76–81 GHz millimetre-wave high-frequency band;

- Different typical applications: Audio chips are used in in-vehicle audio-visual systems and smart audio devices; radar chips are used in in-vehicle perception systems and industrial ranging radars.